Fund Profile
ＮＥＸＴ ＦＵＮＤＳ 日経半導体株指数連動型上場投信
Fund Code: G15233
TSE 200A
内国投資信託受益証券
4.7
Fund profile
Fund & issuer information
Funds
Fund Code
G15233
Securities Code
200A0
EDINET Code
E12460
Specified Securities Type
内国投資信託受益証券
Account Closing Date 1
4.7
Account Closing Date 2
10.7
Fund Code
G15233
Securities Code
200A0
EDINET Code
E12460
Specified Securities Type
内国投資信託受益証券
Account Closing Date 1
4.7
Account Closing Date 2
10.7
ＮＥＸＴ ＦＵＮＤＳ 日経半導体株指数連動型上場投信 — recent fund filings
Fund: G15233 · TSE: 200A7 filings
Latest 2026-06-24
ＮＥＸＴ ＦＵＮＤＳ 日経半導体株指数連動型上場投信 has 7 recent EDINET fund disclosures on file, the most recent submitted on 2026-06-24. Filed under issuer EDINET code E12460. Open any filing below to read the financial statements and PDF attachments.
Recent filings
- 有価証券報告書（内国投資信託受益証券）－第4期(2025/10/08－2026/04/07)
- 有価証券届出書（内国投資信託受益証券）
- 有価証券報告書（内国投資信託受益証券）－第3期(2025/04/08－2025/10/07)
- 有価証券届出書（内国投資信託受益証券）
Related disclosures