Fund Profile
上場インデックスファンド日経半導体株
Fund Code: G15262
TSE 213A
内国投資信託受益証券
1.8
Fund profile
Fund & issuer information
Funds
Fund Code
G15262
Securities Code
213A0
EDINET Code
E12430
Specified Securities Type
内国投資信託受益証券
Account Closing Date 1
1.8
Account Closing Date 2
7.8
Fund Code
G15262
Securities Code
213A0
EDINET Code
E12430
Specified Securities Type
内国投資信託受益証券
Account Closing Date 1
1.8
Account Closing Date 2
7.8
上場インデックスファンド日経半導体株 — recent fund filings
Fund: G15262 · TSE: 213A6 filings
Latest 2026-04-08
上場インデックスファンド日経半導体株 has 6 recent EDINET fund disclosures on file, the most recent submitted on 2026-04-08. Filed under issuer EDINET code E12430. Open any filing below to read the financial statements and PDF attachments.
Recent filings
- 有価証券届出書（内国投資信託受益証券）
- 有価証券報告書（内国投資信託受益証券）－第3期(2025/07/09－2026/01/08)
- 有価証券届出書（内国投資信託受益証券）
- 有価証券報告書（内国投資信託受益証券）－第2期(2025/01/09－2025/07/08)
Related disclosures