Fund Profile
ＮＥＸＴ ＦＵＮＤＳ Ｓ＆Ｐ ５００ 半導体・半導体製造装置３５％キャップ指数連動型上場投信
Fund Code: G15465
TSE 346A
内国投資信託受益証券
9.10
Fund profile
Fund & issuer information
Funds
Fund Code
G15465
Securities Code
346A0
EDINET Code
E12460
Specified Securities Type
内国投資信託受益証券
Account Closing Date 1
9.10
Fund Code
G15465
Securities Code
346A0
EDINET Code
E12460
Specified Securities Type
内国投資信託受益証券
Account Closing Date 1
9.10
ＮＥＸＴ ＦＵＮＤＳ Ｓ＆Ｐ ５００ 半導体・半導体製造装置３５％キャップ指数連動型上場投信 — recent fund filings
Fund: G15465 · TSE: 346A4 filings
Latest 2026-05-27
ＮＥＸＴ ＦＵＮＤＳ Ｓ＆Ｐ ５００ 半導体・半導体製造装置３５％キャップ指数連動型上場投信 has 4 recent EDINET fund disclosures on file, the most recent submitted on 2026-05-27. Filed under issuer EDINET code E12460. Open any filing below to read the financial statements and PDF attachments.
Recent filings
- 有価証券届出書（内国投資信託受益証券）
- 半期報告書（内国投資信託受益証券）－第2期(2025/09/11－2026/09/10)
- 有価証券報告書（内国投資信託受益証券）－第1期(2025/03/25－2025/09/10)
- 有価証券届出書（内国投資信託受益証券）
Related disclosures